In a recent Q&A interview with eyefortransport, supply chain executives from Lenovo, Intel and Epson cited shorter product lifecycles as the main challenge facing hi-tech supply chains in the coming 18 months.
In their responses, Alex Fu ? Executive Director for Emerging Market Logistics Operations ? Lenovo; Lai Lai Tan ? Global Logistics Transportation Manager ? Intel; and Jason Tan ? Department Head, Supply Chain Management ? Epson, all cited the increasing pace of hi-tech product life cycles as a significant challenge.
Jason and Lai Lai also cited environmental requirements as a growing factor impacting their work.
When discussing obstacles to hi-tech distribution in the Asia-Pacific region, Alex and Jason cited trade compliance regulations as major concerns. Lai Lai also added shifting manufacturing towards lower cost areas as a new emerging challenge.
Jason, Lai Lai and Alex will expand on these discussions at the Hi-Tech & Electronics Supply Chain Summit, taking place in Singapore, September 20-21. They will join a group of 20 other speakers to discuss these issues and others before an audience of over 100 senior supply chain executives from the hi-tech industry.
Fewer than 10 complimentary passes remain for senior hi-tech supply chain executives to attend the event. These are available upon application to eyefortransport.
Companies that provide services or solutions to hi-tech supply chains can also join the event through a range of sponsorship, exhibition and participation options. Contact eyefortransport for details.
The full Q&A responses can be read here: http://www.eft.com/hitechAsia/qa-landing.shtml?utm_source=pr%2Bweb&utm_medium=press%2Brelease&utm_campaign=media
Details about the event can be found here: http://events.eyefortransport.com/hitechasia/index.shtml?utm_source=pr%2Bweb&utm_medium=press%2Brelease&utm_campaign=media
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